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PD - 93851A
IRF7402
HEXFET ? Power MOSFET
l
l
Generation V Technology
Ultra Low On-Resistance
S
1
8
A
A
D
l
l
l
l
l
N-Channel MOSFET
Very Small SOIC Package
Low Profile (<1.1mm)
Available in Tape & Reel
Fast Switching
S
S
G
2
3
4
7
6
5
D
D
D
V DSS = 20V
R DS(on) = 0.035 ?
Description
Fifth Generation HEXFET ? power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area. This benefit, combined with the fast switching
speed and ruggedized device design that HEXFET
power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device
for use in a wide variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characterstics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infrared or wave soldering techniques.
Power dissipation of greater than 0.8 W is possible in a
typical PCB mount application.
Absolute Maximum Ratings
T o p V ie w
SO-8
Parameter
Max.
Units
I D @ T A = 25°C
Continuous Drain Current, V GS @ 4.5V
6.8
I D @ T A = 70°C
I DM
P D @T A = 25°C
P D @T A = 70°C
V GS
dv/dt
T J, T STG
Continuous Drain Current, V GS @ 4.5V
Pulsed Drain Current ?
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ?
Junction and Storage Temperature Range
5.4
54
2.5
1.6
0.02
± 12
5.0
-55 to + 150
A
W
W/°C
V
V/ns
°C
Thermal Resistance
Parameter
Max.
Units
R θ JA
www.irf.com
Maximum Junction-to-Ambient ?
50
°C/W
1
2/22/00
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